https://www.ebooknetworking.net/books_detail-3826578058.html

Development of Advanced Endpoint Detection and Process Control for Chemical Mechanical Polishing (CMP) in VLSI Circuit Fabrication (Berichte Aus Der Halbleitertechnik)

Name: Development of Advanced Endpoint Detection and Process Control for Chemical Mechanical Polishing (CMP) in VLSI Circuit Fabrication (Berichte Aus Der Halbleitertechnik)
Author: Gotz Springer
ISBN: 9783826578052

AuthorGotz Springer

PublisherShaker Verlag GmbH, Germany

Shop on Amazon — choose your country

🇺🇸 USA 🇨🇦 Canada 🇬🇧 UK 🇩🇪 Germany 🇫🇷 France 🇮🇳 India

Buy New on Amazon 🇺🇸 Buy Used — $106.45

Book Details

Author(s)Gotz Springer

PublisherShaker Verlag GmbH, Germany

ISBN / ASIN3826578058

ISBN-139783826578052

Sales Rank12,899,598

MarketplaceUnited States 🇺🇸