Worldwide Ethernet Semiconductor 2004-2008 Forecast and Analysis

This IDC study primarily examines all Ethernet ASSP/ASICs shipping into networking markets including network interface card (NIC)/LAN on motherboard (LOM) (within desktops, notebooks, and servers) and LAN switch infrastructure (fixed and modular Layer 2, Layer 3, and Layer 4–7 switches). IDC also includes coverage of Ethernet semiconductors shipping within other system markets that offer this connectivity feature. Examples here include broadband customer premise equipment (CPE), WLAN access points, routers, and IP phones. A top-line forecast for application-specific semiconductor products is provided segmented for 2004–2008 by key end markets and speed.

"In 2004, the market for Ethernet semiconductors continued to benefit from higher IT spending. In particular, increased sales of GbE Layer 2 and Layer 3 LAN switches from OEMs such as Cisco Systems, Nortel Networks, HP, 3Com, D-Link, Extreme Networks, and Dell drove considerable growth in 2004. The introduction of more cost-effective unmanaged and managed fixed-port solutions for small office/home office and small/medium-sized business environments coupled with more scalable modular solutions for large enterprises continued to attract healthy demand this year." — Sean Lavey, program manager, Semiconductors