Optimizing Pb-free SMT process parameters: a Taguchi approach reveals the most important process steps and best settings for screen-printing and ... Story): An article from: Circuits Assembly

This digital document is an article from Circuits Assembly, published by UP Media Group, Inc. on January 1, 2005. The length of the article is 1667 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.

Citation Details
Title: Optimizing Pb-free SMT process parameters: a Taguchi approach reveals the most important process steps and best settings for screen-printing and reflow, as well as the best combination of paste and board finishes for lead-free soldering.(Cover Story)
Author: Antonio Buonomo
Publication:Circuits Assembly (Magazine/Journal)
Date: January 1, 2005
Publisher: UP Media Group, Inc.
Volume: 16 Issue: 1 Page: 22(3)

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