Thermal repeatability in lead-free array rework: a recent study on thermal repeatability shows how even small changes in process variables can have a ... Repair): An article from: Circuits Assembly

This digital document is an article from Circuits Assembly, published by UP Media Group, Inc. on April 1, 2004. The length of the article is 1709 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.

Citation Details
Title: Thermal repeatability in lead-free array rework: a recent study on thermal repeatability shows how even small changes in process variables can have a significant impact on the end result in lead-free array rework.(Rework and Repair)
Author: Craig Brown
Publication:Circuits Assembly (Magazine/Journal)
Date: April 1, 2004
Publisher: UP Media Group, Inc.
Volume: 15 Issue: 4 Page: 40(4)

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