CHINA: Joint venture construction plans for proposed $175,000,000 chip testing and assembly plant, SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORP. ... & Plant Operations in the Developing World
Book Details
PublisherWorldwide Projects, Inc.
ISBN / ASINB00082VB4O
ISBN-13978B00082VB44
AvailabilityAvailable for download now
MarketplaceUnited States 🇺🇸
Description
This digital document is an article from WWP-Report on Engineering Construct & Plant Operations in the Developing World, published by Worldwide Projects, Inc. on August 1, 2004. The length of the article is 1609 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.
Citation Details
Title: CHINA: Joint venture construction plans for proposed $175,000,000 chip testing and assembly plant, SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORP. (SMIC) [China] Order #: 081104.
Publication:WWP-Report on Engineering Construct & Plant Operations in the Developing World (Newsletter)
Date: August 1, 2004
Publisher: Worldwide Projects, Inc.
Volume: 13 Issue: 08
Distributed by Thomson Gale
Citation Details
Title: CHINA: Joint venture construction plans for proposed $175,000,000 chip testing and assembly plant, SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORP. (SMIC) [China] Order #: 081104.
Publication:WWP-Report on Engineering Construct & Plant Operations in the Developing World (Newsletter)
Date: August 1, 2004
Publisher: Worldwide Projects, Inc.
Volume: 13 Issue: 08
Distributed by Thomson Gale
