Flip chip packaging: a hot topic: flip chip technology appears to be one bright spot in the electronics industry after a difficult year.(On the Forefront): An article from: Circuits Assembly
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Book Details
Author(s)
E. Jan Vardaman
Publisher
UP Media Group, Inc.
ISBN / ASIN
B0008DYGA4
ISBN-13
978B0008DYGA8
Marketplace
France 🇫🇷
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Description
This digital document is an article from Circuits Assembly, published by UP Media Group, Inc. on November 1, 2002. The length of the article is 1003 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.
Citation Details
Title: Flip chip packaging: a hot topic: flip chip technology appears to be one bright spot in the electronics industry after a difficult year.(On the Forefront)
Author: E. Jan Vardaman
Publication:Circuits Assembly (Magazine/Journal)
Date: November 1, 2002
Publisher: UP Media Group, Inc.
Volume: 13 Issue: 11 Page: 18(2)
Distributed by Thomson Gale
Citation Details
Title: Flip chip packaging: a hot topic: flip chip technology appears to be one bright spot in the electronics industry after a difficult year.(On the Forefront)
Author: E. Jan Vardaman
Publication:Circuits Assembly (Magazine/Journal)
Date: November 1, 2002
Publisher: UP Media Group, Inc.
Volume: 13 Issue: 11 Page: 18(2)
Distributed by Thomson Gale
