Flip chip processing factors: implementing flip-chip process capability is not a simple task. Find out how to make the process less painful.(Problem Solved): An article from: Circuits Assembly
Book Details
Author(s)
S. Craig Beddingfield
Publisher
UP Media Group, Inc.
ISBN / ASIN
B0008DYGAO
ISBN-13
978B0008DYGA8
Availability
Available for download now
Sales Rank
#13,713,228
Marketplace
United States 🇺🇸
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Description
This digital document is an article from Circuits Assembly, published by UP Media Group, Inc. on November 1, 2002. The length of the article is 718 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.
Citation Details
Title: Flip chip processing factors: implementing flip-chip process capability is not a simple task. Find out how to make the process less painful.(Problem Solved)
Author: S. Craig Beddingfield
Publication:Circuits Assembly (Magazine/Journal)
Date: November 1, 2002
Publisher: UP Media Group, Inc.
Volume: 13 Issue: 11 Page: 22(1)
Distributed by Thomson Gale
Citation Details
Title: Flip chip processing factors: implementing flip-chip process capability is not a simple task. Find out how to make the process less painful.(Problem Solved)
Author: S. Craig Beddingfield
Publication:Circuits Assembly (Magazine/Journal)
Date: November 1, 2002
Publisher: UP Media Group, Inc.
Volume: 13 Issue: 11 Page: 22(1)
Distributed by Thomson Gale
