CSP and flip chip assembly using tacky flux: a recent research project found how placement accuracy of CSPs and flip chips is affected by the ... An article from: Circuits Assembly

This digital document is an article from Circuits Assembly, published by UP Media Group, Inc. on October 1, 2002. The length of the article is 1888 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.

Citation Details
Title: CSP and flip chip assembly using tacky flux: a recent research project found how placement accuracy of CSPs and flip chips is affected by the component pitch and board layout.(Component Placement)
Author: Marina Nikeschina
Publication:Circuits Assembly (Magazine/Journal)
Date: October 1, 2002
Publisher: UP Media Group, Inc.
Volume: 13 Issue: 10 Page: 40(4)

Distributed by Thomson Gale