Next-generation laser rework: some applications for high-density and lead-free manufacturing process are explored.(Rework & Repair): An article from: Circuits Assembly

This digital document is an article from Circuits Assembly, published by UP Media Group, Inc. on August 1, 2003. The length of the article is 2535 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.

Citation Details
Title: Next-generation laser rework: some applications for high-density and lead-free manufacturing process are explored.(Rework & Repair)
Author: Robert Farrel
Publication:Circuits Assembly (Magazine/Journal)
Date: August 1, 2003
Publisher: UP Media Group, Inc.
Volume: 14 Issue: 8 Page: 22(4)

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