Three-Dimensional Simulation of Microchip Encapsulation Process.(Statistical Data Included): An article from: Polymer Engineering and Science

This digital document is an article from Polymer Engineering and Science, published by Society of Plastics Engineers, Inc. on March 1, 2000. The length of the article is 4129 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.

Citation Details
Title: Three-Dimensional Simulation of Microchip Encapsulation Process.(Statistical Data Included)
Author: Ruihua Han
Publication:Polymer Engineering and Science (Refereed)
Date: March 1, 2000
Publisher: Society of Plastics Engineers, Inc.
Volume: 40 Issue: 3 Page: 776

Article Type: Statistical Data Included

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