PACKAGING: Microsemi Patents Microwave Flip Chip.: An article from: Electronic Materials Update

This digital document is an article from Electronic Materials Update, published by Business Communications Company, Inc. on April 1, 2001. The length of the article is 428 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.

Citation Details
Title: PACKAGING: Microsemi Patents Microwave Flip Chip.
Publication:Electronic Materials Update (Newsletter)
Date: April 1, 2001
Publisher: Business Communications Company, Inc.
Volume: 15 Page: NA

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