Die Bonding in an Optoelectronic World -- PCB assemblers venturing into optoelectronics will encounter new substrates and package designs that call ... An article from: Circuits Assembly
Book Details
Author(s)Don Moore
PublisherUP Media Group, Inc.
ISBN / ASINB0008IL4EA
ISBN-13978B0008IL4E4
MarketplaceGermany 🇩🇪
