Stress relaxation behavior of 3501-6 epoxy resin during cure.: An article from: Polymer Engineering and Science
Book Details
Author(s)Yeong K. Kim, Scott R. White
PublisherSociety of Plastics Engineers, Inc.
ISBN / ASINB00096Q0MC
ISBN-13978B00096Q0M9
MarketplaceFrance 🇫🇷
Description
This digital document is an article from Polymer Engineering and Science, published by Society of Plastics Engineers, Inc. on December 15, 1996. The length of the article is 5437 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.
From the author: Epoxy resins and other thermosetting polymers change from liquids to solids during cure. A precise process model of these materials requires a constitutive model that is able to describe this transformation in its entirety. In this study the viscoelastic properties of a commercial epoxy resin were characterized using a dynamic mechanical analyzer (DMA). Specimens were tested at several different cure states to develop master curves of stress relaxation behavior during cure. Using this experimental data, the relaxation modulus was then modeled in a thermorheologically complex manner. A Prony (exponential) series was used to describe the relaxation modulus. An original model was developed for the stress relaxation times based on similar work by Scherer (16) on the relaxation of glass. Shift functions used to obtain reduced times are empirically derived based on curve fits to the data. The data show that the cure state has a profound effect on the stress relaxation of epoxy. More important, the relaxation behavior above gelation is shown to be quite sensitive to degree of cure.
Citation Details
Title: Stress relaxation behavior of 3501-6 epoxy resin during cure.
Author: Yeong K. Kim
Publication:Polymer Engineering and Science (Refereed)
Date: December 15, 1996
Publisher: Society of Plastics Engineers, Inc.
Volume: v36 Issue: n23 Page: p2852(11)
Distributed by Thomson Gale
From the author: Epoxy resins and other thermosetting polymers change from liquids to solids during cure. A precise process model of these materials requires a constitutive model that is able to describe this transformation in its entirety. In this study the viscoelastic properties of a commercial epoxy resin were characterized using a dynamic mechanical analyzer (DMA). Specimens were tested at several different cure states to develop master curves of stress relaxation behavior during cure. Using this experimental data, the relaxation modulus was then modeled in a thermorheologically complex manner. A Prony (exponential) series was used to describe the relaxation modulus. An original model was developed for the stress relaxation times based on similar work by Scherer (16) on the relaxation of glass. Shift functions used to obtain reduced times are empirically derived based on curve fits to the data. The data show that the cure state has a profound effect on the stress relaxation of epoxy. More important, the relaxation behavior above gelation is shown to be quite sensitive to degree of cure.
Citation Details
Title: Stress relaxation behavior of 3501-6 epoxy resin during cure.
Author: Yeong K. Kim
Publication:Polymer Engineering and Science (Refereed)
Date: December 15, 1996
Publisher: Society of Plastics Engineers, Inc.
Volume: v36 Issue: n23 Page: p2852(11)
Distributed by Thomson Gale
