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Effects of oxidation and particle shape on critical volume fractions of silver-coated copper powders in conductive adhesives for microelectronic ... article from: Polymer Engineering and Science

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PublisherThomson Gale
ISBN / ASINB00096SVH4
ISBN-13978B00096SVH9
AvailabilityAvailable for download now
Sales Rank99,999,999
MarketplaceUnited States  🇺🇸

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This digital document is an article from Polymer Engineering and Science, published by Thomson Gale on November 1, 2004. The length of the article is 4580 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.

From the author: The effects of oxidation and particle shape on critical volume fractions of silver-coated copper powders in conductive adhesives are investigated. Silver-coated copper powders with spherical and flake-shaped particles were oxidized at temperatures of 30[degrees]C, 175[degrees]C and 240[degrees]C for two hours and dispersed in an epoxy matrix. As silver-coated copper powders are oxidized at 30[degrees]C and 175[degrees]C, the critical volume fractions of the conductive adhesives are slightly affected by oxidation and particle shape at these temperatures. As the oxidation temperature approaches 240[degrees]C, the critical volume fractions of the conductive adhesives are strongly affected by oxidation temperature and particle shape, owing to the formation of oxides such as [Cu.sub.2]O on the surface of silver-coated copper powder--Cu diffuses from the interior to the surface of silver-coated copper powder and reacts with the oxygen in the air. Silver-coated copper powder with flake-shaped particles shows lower critical volume fractions in conductive adhesives than silver-coated copper powder with spherically shaped particles. Polym. Eng. Sci. 44:2075-2082. 2004. [c] 2004 Society of Plastics Engineers.

Citation Details
Title: Effects of oxidation and particle shape on critical volume fractions of silver-coated copper powders in conductive adhesives for microelectronic applications.
Author: Yung-Sen Lin
Publication:Polymer Engineering and Science (Magazine/Journal)
Date: November 1, 2004
Publisher: Thomson Gale
Volume: 44 Issue: 11 Page: 2075(8)

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