Thermally conductive EMC (epoxy molding compound) for microelectronic encapsulation.: An article from: Polymer Engineering and Science
Book Details
PublisherSociety of Plastics Engineers, Inc.
ISBN / ASINB00098T4FK
ISBN-13978B00098T4F3
AvailabilityAvailable for download now
MarketplaceUnited States 🇺🇸
Description
This digital document is an article from Polymer Engineering and Science, published by Society of Plastics Engineers, Inc. on April 1, 1999. The length of the article is 4075 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.
From the author: Owing to the trend of faster and denser circuit design, the dielectric properties of packaging materials for semi-conductors will have greater influence on performance and reliability. Also, as chips become more densely packaged, thermal dissipation becomes a critical reliability issue. Consequently, four important properties for manufacturing semi-conductor packaging are: low values of dielectric constants, high values of thermal conductivity, relatively low values of thermal expansion coefficients, and low cost. Thus, in this study, AlN (Aluminum Nitride) was selected as the filler for an epoxy matrix to achieve increased performance of an EMC. As a result, the thermal conductivity of an EMC filled with 70 vol% of AlN increased as much as 7-8 times compared with the EMC filled with a crystalline silica (vol. 70 %). When more than 60 vol% of AlN was added to the EMC, the dielectric constants and thermal expansion coefficient decreased rapidly.
Citation Details
Title: Thermally conductive EMC (epoxy molding compound) for microelectronic encapsulation.
Author: Wonho Kim
Publication:Polymer Engineering and Science (Refereed)
Date: April 1, 1999
Publisher: Society of Plastics Engineers, Inc.
Volume: 39 Issue: 4 Page: 756(1)
Distributed by Thomson Gale
From the author: Owing to the trend of faster and denser circuit design, the dielectric properties of packaging materials for semi-conductors will have greater influence on performance and reliability. Also, as chips become more densely packaged, thermal dissipation becomes a critical reliability issue. Consequently, four important properties for manufacturing semi-conductor packaging are: low values of dielectric constants, high values of thermal conductivity, relatively low values of thermal expansion coefficients, and low cost. Thus, in this study, AlN (Aluminum Nitride) was selected as the filler for an epoxy matrix to achieve increased performance of an EMC. As a result, the thermal conductivity of an EMC filled with 70 vol% of AlN increased as much as 7-8 times compared with the EMC filled with a crystalline silica (vol. 70 %). When more than 60 vol% of AlN was added to the EMC, the dielectric constants and thermal expansion coefficient decreased rapidly.
Citation Details
Title: Thermally conductive EMC (epoxy molding compound) for microelectronic encapsulation.
Author: Wonho Kim
Publication:Polymer Engineering and Science (Refereed)
Date: April 1, 1999
Publisher: Society of Plastics Engineers, Inc.
Volume: 39 Issue: 4 Page: 756(1)
Distributed by Thomson Gale
