Preventing voids in CSP and BGA underfill encapsulants: the right underfill can be as effective as the best solder paste.(Underfill Selection): An article from: Circuits Assembly

This digital document is an article from Circuits Assembly, published by UP Media Group, Inc. on October 1, 2004. The length of the article is 1519 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.

Citation Details
Title: Preventing voids in CSP and BGA underfill encapsulants: the right underfill can be as effective as the best solder paste.(Underfill Selection)
Author: Karl Loh
Publication:Circuits Assembly (Magazine/Journal)
Date: October 1, 2004
Publisher: UP Media Group, Inc.
Volume: 15 Issue: 10 Page: 42(3)

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