Get on board: solving thermal problems at board level: the early bird gets the worm. Instead of waiting to address thermal issues at the system level, ... from: Printed Circuit Design & Manufacture

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Citation Details
Title: Get on board: solving thermal problems at board level: the early bird gets the worm. Instead of waiting to address thermal issues at the system level, tackle them at board level instead.(THERMAL MANAGEMENT)
Author: Robin Bornoff
Publication:Printed Circuit Design & Manufacture (Magazine/Journal)
Date: June 1, 2005
Publisher: UP Media Group, Inc.
Volume: 22 Issue: 6 Page: 38(4)

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