Why a 2-D soldering pass won't (usually) improve hole-fill: optimized thermal design lies in board layout and placement.(Wave Soldering): An article from: Circuits Assembly

This digital document is an article from Circuits Assembly, published by Thomson Gale on September 1, 2005. The length of the article is 543 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.

Citation Details
Title: Why a 2-D soldering pass won't (usually) improve hole-fill: optimized thermal design lies in board layout and placement.(Wave Soldering)
Author: Gerjan Diepstraten
Publication:Circuits Assembly (Magazine/Journal)
Date: September 1, 2005
Publisher: Thomson Gale
Volume: 16 Issue: 9 Page: 52(1)

Distributed by Thomson Gale