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Using traditional SMT processes for semiconductor packaging: a two-part look at bumping and encapsulation of flip-chip BGAs.(Screen Printing): An article from: Circuits Assembly Buy on Amazon

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Using traditional SMT processes for semiconductor packaging: a two-part look at bumping and encapsulation of flip-chip BGAs.(Screen Printing): An article from: Circuits Assembly

AuthorClive Ashmore
PublisherThomson Gale
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Book Details

Author(s)Clive Ashmore
PublisherThomson Gale
ISBN / ASINB000CETV5E
ISBN-13978B000CETV57
MarketplaceUnited States  🇺🇸

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