Using traditional SMT processes for semiconductor packaging: a two-part look at bumping and encapsulation of flip-chip BGAs.(Screen Printing): An article from: Circuits Assembly

This digital document is an article from Circuits Assembly, published by Thomson Gale on November 1, 2005. The length of the article is 608 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.

Citation Details
Title: Using traditional SMT processes for semiconductor packaging: a two-part look at bumping and encapsulation of flip-chip BGAs.(Screen Printing)
Author: Clive Ashmore
Publication:Circuits Assembly (Magazine/Journal)
Date: November 1, 2005
Publisher: Thomson Gale
Volume: 16 Issue: 11 Page: 28(1)

Distributed by Thomson Gale