Choosing a BGA inspection system: a review of three types of nondestructive equipment: 2-D x-ray, endoscopic and 3-D x-ray.(Soldering Tips): An article from: Circuits Assembly

This digital document is an article from Circuits Assembly, published by UP Media Group, Inc. on January 1, 2006. The length of the article is 899 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.

Citation Details
Title: Choosing a BGA inspection system: a review of three types of nondestructive equipment: 2-D x-ray, endoscopic and 3-D x-ray.(Soldering Tips)
Publication:Circuits Assembly (Magazine/Journal)
Date: January 1, 2006
Publisher: UP Media Group, Inc.
Volume: 17 Issue: 1 Page: 58(2)

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