IEC 60749-34 Ed. 1.0 b:2005, Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forward conduction (load currents) are periodically applied and removed causing rapid changes of temperature. The power cycling test is complementary to high temperature operating life.