Creating ideal solder joints: effects of stencils and thermal profile are reviewed.(Reflow Soldering): An article from: Circuits Assembly

This digital document is an article from Circuits Assembly, published by Thomson Gale on November 1, 2007. The length of the article is 1640 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.

Citation Details
Title: Creating ideal solder joints: effects of stencils and thermal profile are reviewed.(Reflow Soldering)
Author: Zulki Khan
Publication:Circuits Assembly (Magazine/Journal)
Date: November 1, 2007
Publisher: Thomson Gale
Volume: 18 Issue: 11 Page: 38(3)

Distributed by Thomson Gale