Copper plating and microvia fill for advanced PCBS: vertical in-line plating systems are well-suited for high-volume PCB manufacturing that requires ... An article from: Printed Circuit Design & Fab
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Book Details
Author(s)
Bruce Chen
Publisher
UP Media Group, Inc.
ISBN / ASIN
B001K9JTYI
ISBN-13
978B001K9JTY2
Marketplace
France 🇫🇷
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Description
This digital document is an article from Printed Circuit Design & Fab, published by UP Media Group, Inc. on August 1, 2008. The length of the article is 1322 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available immediately after purchase. You can view it with any web browser.
Citation Details
Title: Copper plating and microvia fill for advanced PCBS: vertical in-line plating systems are well-suited for high-volume PCB manufacturing that requires copper plated microvia fill.(PLANTING)
Author: Bruce Chen
Publication:Printed Circuit Design & Fab (Magazine/Journal)
Date: August 1, 2008
Publisher: UP Media Group, Inc.
Volume: 25 Issue: 8 Page: 40(3)
Distributed by Gale, a part of Cengage Learning
Citation Details
Title: Copper plating and microvia fill for advanced PCBS: vertical in-line plating systems are well-suited for high-volume PCB manufacturing that requires copper plated microvia fill.(PLANTING)
Author: Bruce Chen
Publication:Printed Circuit Design & Fab (Magazine/Journal)
Date: August 1, 2008
Publisher: UP Media Group, Inc.
Volume: 25 Issue: 8 Page: 40(3)
Distributed by Gale, a part of Cengage Learning
