Copper erosion: the Influence of metallurgy on copper dissolution: the rate of copper dissolution in lead-free soldering may be linked to the physical ... An article from: Printed Circuit Design & Fab

This digital document is an article from Printed Circuit Design & Fab, published by UP Media Group, Inc. on October 1, 2008. The length of the article is 1688 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available immediately after purchase. You can view it with any web browser.

Citation Details
Title: Copper erosion: the Influence of metallurgy on copper dissolution: the rate of copper dissolution in lead-free soldering may be linked to the physical characteristics of the electroplated copper.(PLATING)
Author: Chrys Shea
Publication:Printed Circuit Design & Fab (Magazine/Journal)
Date: October 1, 2008
Publisher: UP Media Group, Inc.
Volume: 25 Issue: 10 Page: 35(3)

Distributed by Gale, a part of Cengage Learning