Tackling the copper wrap plate requirement: wrap plating improves reliability of via structures, but conventional techniques increase surface copper ... An article from: Printed Circuit Design & Fab

This digital document is an article from Printed Circuit Design & Fab, published by UP Media Group, Inc. on July 1, 2009. The length of the article is 2330 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available immediately after purchase. You can view it with any web browser.

Citation Details
Title: Tackling the copper wrap plate requirement: wrap plating improves reliability of via structures, but conventional techniques increase surface copper thickness, limiting HDI and other fine-line designs.(PLATING SPECIFICATIONS)
Author: Rajwant Sidhu
Publication:Printed Circuit Design & Fab (Magazine/Journal)
Date: July 1, 2009
Publisher: UP Media Group, Inc.
Volume: 26 Issue: 7 Page: 23(4)

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