Thermal-mechanical analysis of a different leadframe thickness of semiconductor package under the reflow process.(Report): An article from: American Journal of Applied Sciences

This digital document is an article from American Journal of Applied Sciences, published by Science Publications on April 1, 2009. The length of the article is 3784 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available immediately after purchase. You can view it with any web browser.

From the author: Key words: 3D Stacked-die, design, leadframe, QFN, stress, thermo-mechanical

Citation Details
Title: Thermal-mechanical analysis of a different leadframe thickness of semiconductor package under the reflow process.(Report)
Author: S. Abdullah
Publication:American Journal of Applied Sciences (Magazine/Journal)
Date: April 1, 2009
Publisher: Science Publications
Volume: 6 Issue: 4 Page: 616(10)

Article Type: Report

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