Information management gaps for board fabrication and assembly: progress toward complete data packages has been slow.(iNEMI ROADMAP): An article from: Circuits Assembly

This digital document is an article from Circuits Assembly, published by UP Media Group, Inc. on September 1, 2009. The length of the article is 1953 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available immediately after purchase. You can view it with any web browser.

Citation Details
Title: Information management gaps for board fabrication and assembly: progress toward complete data packages has been slow.(iNEMI ROADMAP)
Author: Eric Simmon
Publication:Circuits Assembly (Magazine/Journal)
Date: September 1, 2009
Publisher: UP Media Group, Inc.
Volume: 20 Issue: 9 Page: 29(3)

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