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3-D IC bonding: supply-chain roles are changing, with EMS firms expected to take a bigger chip-packaging role.(CHIP PACKAGING): An article from: Circuits Assembly

Name: 3-D IC bonding: supply-chain roles are changing, with EMS firms expected to take a bigger chip-packaging role.(CHIP PACKAGING): An article from: Circuits Assembly
Author: Chris Sanders
ISBN: 978B002RENS24

AuthorChris Sanders

PublisherUP Media Group, Inc.

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Book Details

Author(s)Chris Sanders

PublisherUP Media Group, Inc.

ISBN / ASINB002RENS2O

ISBN-13978B002RENS24

MarketplaceUnited States 🇺🇸

3-D IC bonding: supply-chain roles are changing, with EMS firms expected to take a bigger chip-packaging role.(CHIP PACKAGING): An article from: Circuits Assembly

Book Details

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