3-D IC bonding: supply-chain roles are changing, with EMS firms expected to take a bigger chip-packaging role.(CHIP PACKAGING): An article from: Circuits Assembly
Book Details
Author(s)
Chris Sanders
Publisher
UP Media Group, Inc.
ISBN / ASIN
B002RENS2O
ISBN-13
978B002RENS24
Availability
Available for download now
Sales Rank
#99,999,999
Marketplace
United States 🇺🇸
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Description
This digital document is an article from Circuits Assembly, published by UP Media Group, Inc. on September 1, 2009. The length of the article is 925 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available immediately after purchase. You can view it with any web browser.
Citation Details
Title: 3-D IC bonding: supply-chain roles are changing, with EMS firms expected to take a bigger chip-packaging role.(CHIP PACKAGING)
Author: Chris Sanders
Publication:Circuits Assembly (Magazine/Journal)
Date: September 1, 2009
Publisher: UP Media Group, Inc.
Volume: 20 Issue: 9 Page: 34(2)
Distributed by Gale, a part of Cengage Learning
Citation Details
Title: 3-D IC bonding: supply-chain roles are changing, with EMS firms expected to take a bigger chip-packaging role.(CHIP PACKAGING)
Author: Chris Sanders
Publication:Circuits Assembly (Magazine/Journal)
Date: September 1, 2009
Publisher: UP Media Group, Inc.
Volume: 20 Issue: 9 Page: 34(2)
Distributed by Gale, a part of Cengage Learning
