A novel amide and imide copolymer as matrix resin for UV photoresist.(Report): An article from: Polymer Engineering and Science
Book Details
PublisherSociety of Plastics Engineers, Inc.
ISBN / ASINB0030XRSJK
ISBN-13978B0030XRSJ9
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MarketplaceUnited States 🇺🇸
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This digital document is an article from Polymer Engineering and Science, published by Society of Plastics Engineers, Inc. on August 1, 2009. The length of the article is 3337 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available immediately after purchase. You can view it with any web browser.
From the author: A novel amide and imide copolymer, poly(N-phenylme-thacrylamide-co-N-(p-hydroxypheny)maleimide) was synthesized for the matrix resin of ultraviolet (UV) photoresist. Elemental analysis and self-polymerization experiment verified that this copolymer was very close to 1:1 (molar ratio) in composition and was predominately alternating. It was able to dissolve in various organic solvents and form uniform curing film when spin-coating. Its differential scanning calorimetry and thermogravimetry analysis test showed good thermal stability and its glass transition temperature ([T.sub.g]) was about 280[degrees]C. Photolithographic experiment indicated that the UV photoresist formulated with this copolymer as matrix resin was achieved the resolution of about 5 [micro]m, the contrast of 3.001, and the sensitivity of 32 [mJ/cm.sup.2]. With good plasma etching resistance, the photoresist studied was able to bear 250[degrees]C for 30 min without thermal deformation during the thermal resistance test. POLYM. ENG. SCI., 49:1621-1626, 2009. [C] 2009 Society of Plastics Engineers
Citation Details
Title: A novel amide and imide copolymer as matrix resin for UV photoresist.(Report)
Author: Jianguo Liu
Publication:Polymer Engineering and Science (Magazine/Journal)
Date: August 1, 2009
Publisher: Society of Plastics Engineers, Inc.
Volume: 49 Issue: 8 Page: 1621(6)
Article Type: Report
Distributed by Gale, a part of Cengage Learning
From the author: A novel amide and imide copolymer, poly(N-phenylme-thacrylamide-co-N-(p-hydroxypheny)maleimide) was synthesized for the matrix resin of ultraviolet (UV) photoresist. Elemental analysis and self-polymerization experiment verified that this copolymer was very close to 1:1 (molar ratio) in composition and was predominately alternating. It was able to dissolve in various organic solvents and form uniform curing film when spin-coating. Its differential scanning calorimetry and thermogravimetry analysis test showed good thermal stability and its glass transition temperature ([T.sub.g]) was about 280[degrees]C. Photolithographic experiment indicated that the UV photoresist formulated with this copolymer as matrix resin was achieved the resolution of about 5 [micro]m, the contrast of 3.001, and the sensitivity of 32 [mJ/cm.sup.2]. With good plasma etching resistance, the photoresist studied was able to bear 250[degrees]C for 30 min without thermal deformation during the thermal resistance test. POLYM. ENG. SCI., 49:1621-1626, 2009. [C] 2009 Society of Plastics Engineers
Citation Details
Title: A novel amide and imide copolymer as matrix resin for UV photoresist.(Report)
Author: Jianguo Liu
Publication:Polymer Engineering and Science (Magazine/Journal)
Date: August 1, 2009
Publisher: Society of Plastics Engineers, Inc.
Volume: 49 Issue: 8 Page: 1621(6)
Article Type: Report
Distributed by Gale, a part of Cengage Learning
