Improved electrolytic COPPER PLATING for Flex PWBs; a novel process is said to improve product interconnection and mechanical reliability.(COPPER ... An article from: Printed Circuit Design & Fab
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This digital document is an article from Printed Circuit Design & Fab, published by UP Media Group, Inc. on February 1, 2010. The length of the article is 2114 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available immediately after purchase. You can view it with any web browser.
Citation Details Title: Improved electrolytic COPPER PLATING for Flex PWBs; a novel process is said to improve product interconnection and mechanical reliability.(COPPER PLATING) Author: Hiroshi Hoshiyama Publication:Printed Circuit Design & Fab (Magazine/Journal) Date: February 1, 2010 Publisher: UP Media Group, Inc. Volume: 27 Issue: 2 Page: 33(4)