Symposium on Adhesives for Structural Applications Held at Picatinny Arsenal Dover, New Jersey, September 27-28, 1961

This symposium was held to disseminate information on the latest developments in structural adhesives bonding. Its goal was to provide authoritative and up-to-date advice on modern adhesives technology, primarily for the use of design engineers in the Ordnance Corps and among Ordnance contractors. The unique feature of this symposium was that the primary requisites for reliable structural adhesive bonds were covered under major session topics. Contents: Joint Design for Primary Structures, Design of Bonded Joints, Peel Testing of Adhesive Bonded Metal, Methods for Determining Stress Distribution in Adherends and Adhesives, Adherend Surface Preparation, Structural Adhesives - Characteristics and Application, Importance of Evaluation of Adhesives for All Environmental Conditions and Permanence Studies Adhesives in Printed Circuit Applications, Special Adhesives for Rubber Bonding, Recent Developments in High-temperature Adhesives, Room-temperature Curing Adhesives for Structures, Potential of Adhesives for the Future, Adhesives in Ordnance Applications, Significance of Good Process Control, Process Control Considerations for Adhesive Bonding in Production, Treatment of Teflon to Promote Bondability, High-temperature Ceramic Adhesives