Florida Sun shines light on electronic packaging trends: 3D packages, fan-out WLPs, and the migration to copper wire bonding highlighted ECTC.(ON THE ... An article from: Printed Circuit Design & Fab

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Citation Details
Title: Florida Sun shines light on electronic packaging trends: 3D packages, fan-out WLPs, and the migration to copper wire bonding highlighted ECTC.(ON THE FOREFRONT)
Author: E. Jan Vardaman
Publication:Printed Circuit Design & Fab (Magazine/Journal)
Date: July 1, 2011
Publisher: UP Media Group, Inc.
Volume: 28 Issue: 7 Page: 17(1)

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