Florida Sun shines light on electronic packaging trends: 3D packages, fan-out WLPs, and the migration to copper wire bonding highlighted ECTC.(ON THE ... An article from: Printed Circuit Design & Fab
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Book Details
Author(s)
E. Jan Vardaman
Publisher
UP Media Group, Inc.
ISBN / ASIN
B005H2S4IQ
ISBN-13
978B005H2S4I1
Marketplace
Germany 🇩🇪
Description
This digital document is an article from Printed Circuit Design & Fab, published by UP Media Group, Inc. on July 1, 2011. The length of the article is 721 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available immediately after purchase. You can view it with any web browser.
Citation Details
Title: Florida Sun shines light on electronic packaging trends: 3D packages, fan-out WLPs, and the migration to copper wire bonding highlighted ECTC.(ON THE FOREFRONT)
Author: E. Jan Vardaman
Publication:Printed Circuit Design & Fab (Magazine/Journal)
Date: July 1, 2011
Publisher: UP Media Group, Inc.
Volume: 28 Issue: 7 Page: 17(1)
Distributed by Gale, a part of Cengage Learning
Citation Details
Title: Florida Sun shines light on electronic packaging trends: 3D packages, fan-out WLPs, and the migration to copper wire bonding highlighted ECTC.(ON THE FOREFRONT)
Author: E. Jan Vardaman
Publication:Printed Circuit Design & Fab (Magazine/Journal)
Date: July 1, 2011
Publisher: UP Media Group, Inc.
Volume: 28 Issue: 7 Page: 17(1)
Distributed by Gale, a part of Cengage Learning
