Cooling the electronic brain: stacking processing chips can make for more compact computers. But it will take advances in microfluidics to make such ... An article from: Mechanical Engineering-CIME
Book Details
Author(s)Avram Bar-Cohen, Karl J.L. Geisler
ISBN / ASINB00BRC6PLI
ISBN-13978B00BRC6PL4
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Description
This digital document is an article from Mechanical Engineering-CIME, published by American Society of Mechanical Engineers on April 1, 2011. The length of the article is 2092 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available immediately after purchase. You can view it with any web browser.
Citation Details
Title: Cooling the electronic brain: stacking processing chips can make for more compact computers. But it will take advances in microfluidics to make such dense number crunching practical.
Author: Avram Bar-Cohen
Publication:Mechanical Engineering-CIME (Magazine/Journal)
Date: April 1, 2011
Publisher: American Society of Mechanical Engineers
Volume: 133 Issue: 4 Page: 38(4)
Distributed by Gale, a part of Cengage Learning
Citation Details
Title: Cooling the electronic brain: stacking processing chips can make for more compact computers. But it will take advances in microfluidics to make such dense number crunching practical.
Author: Avram Bar-Cohen
Publication:Mechanical Engineering-CIME (Magazine/Journal)
Date: April 1, 2011
Publisher: American Society of Mechanical Engineers
Volume: 133 Issue: 4 Page: 38(4)
Distributed by Gale, a part of Cengage Learning
