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Advanced Materials for Thermal Management of Electronic Packaging by Tong, Xingcun Colin. (Springer,2011) [Hardcover]
Book Details
Publisher
Springer,2011
ISBN / ASIN
B00E2RIMPM
ISBN-13
978B00E2RIMP6
Sales Rank
#99,999,999
Marketplace
United States 🇺🇸
Description
Advanced Materials for Thermal Management of Electronic Packaging by Tong, Xingcun Colin. . Springer, 2011 .
