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Advanced Materials for Thermal Management of Electronic Packaging by Tong, Xingcun Colin. (Springer,2011) [Hardcover]

Name: Advanced Materials for Thermal Management of Electronic Packaging by Tong, Xingcun Colin. (Springer,2011) [Hardcover]
Author: Unknown
ISBN: 978B00E2RIMP6

PublisherSpringer,2011

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Book Details

PublisherSpringer,2011

ISBN / ASINB00E2RIMPM

ISBN-13978B00E2RIMP6

Sales Rank99,999,999

MarketplaceUnited States 🇺🇸

Description

Advanced Materials for Thermal Management of Electronic Packaging by Tong, Xingcun Colin. . Springer, 2011 .