Flip-Chip Bonding Equipment for UV Focal Plane Array Development Based on GaN/AlGaN p-i-n Photodiodes

Name: Flip-Chip Bonding Equipment for UV Focal Plane Array Development Based on GaN/AlGaN p-i-n Photodiodes
Author: Jan Schetzina
ISBN: 978B00JOUC7P5

Author Jan Schetzina

Publisher PN

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Book Details

Author(s) Jan Schetzina

Publisher PN

ISBN / ASIN B00JOUC7PS

ISBN-13 978B00JOUC7P5

Sales Rank #99,999,999

Marketplace United States 🇺🇸

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