https://www.ebooknetworking.net/books_detail-B00JOUC7PS.html

Flip-Chip Bonding Equipment for UV Focal Plane Array Development Based on GaN/AlGaN p-i-n Photodiodes

Name: Flip-Chip Bonding Equipment for UV Focal Plane Array Development Based on GaN/AlGaN p-i-n Photodiodes
Author: Jan Schetzina
ISBN: 978B00JOUC7P5

AuthorJan Schetzina

PublisherPN

Shop on Amazon — choose your country

🇺🇸 USA 🇨🇦 Canada 🇬🇧 UK 🇩🇪 Germany 🇫🇷 France 🇮🇳 India

Buy New on Amazon 🇺🇸 Buy Used — $100.00

Book Details

Author(s)Jan Schetzina

PublisherPN

ISBN / ASINB00JOUC7PS

ISBN-13978B00JOUC7P5

Sales Rank99,999,999

MarketplaceUnited States 🇺🇸