Handbook of Fiber Optic Data Communication: Chapter 2. Transceivers, Packaging, and Photonic Integration

This chapter reviews electro-optical packaging and integration technologies for short distance optical communication. With increasing system performance and bandwidth requirements, optical communication is applied for ever shorter distances. Consequently, novel packaging strategies are required that enable a close integration of optical technology within the system. Today, pluggable transceivers are applied at the system edge and embedded optical modules for onboard assembly are emerging in bandwidth hungry applications. The first high-performance computing systems are now on the market in which optical transceivers are mounted onto the switch chip package. Still, cost and assembly efforts related to optics hinder a more widespread application of optical link technology. Integration strategies at all levels are required to enhance performance and functionality of optics, while reducing cost. Optical printed circuit board technology and integrated photonics offer tight integration between electrical and optical functions.