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Fatigue Life Prediction of Solder Joints in Electronic Packages with AnsysÂ® (The Springer International Series in Engineering and Computer Science) by Erdogan Madenci (2002-12-31)

Name: Fatigue Life Prediction of Solder Joints in Electronic Packages with AnsysÂ® (The Springer International Series in Engineering and Computer Science) by Erdogan Madenci (2002-12-31)
Author: Erdogan Madenci; Ibrahim Guven; Bahattin Kilic;
ISBN: 978B01A1NEND6

AuthorErdogan Madenci; Ibrahim Guven; Bahattin Kilic;

PublisherSpringer; 2003 edition (2002-12-31)

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Book Details

Author(s)Erdogan Madenci; Ibrahim Guven; Bahattin Kilic;

PublisherSpringer; 2003 edition (2002-12-31)

ISBN / ASINB01A1NENDA

ISBN-13978B01A1NEND6

MarketplaceCanada 🇨🇦

Description

Brand New. Will be shipped from US.