GENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET Printer Chipset IC High Performance
9.99
USD
Book Details
PublisherGENNEL
ISBN / ASINB072MSXHJD
ISBN-13978B072MSXHJ9
Sales Rank2,205
MarketplaceUnited States 🇺🇸
Description
* 100% New Heatsink plaster.
* Application: apply to all heatsinkf no fixed clip thermal paste. Idea for MOSFET Heatsink，VGA CARD Northbridge Southbridge Heatsink.
* Features: thermal properties, strong adhesion
* Melting capacity: 0 (200 ℃ / 24Hours)
* Evaporation: 0.001% (200 ℃ / 24Hours)
* Thermal conductivity:> 1.2W/m-K
* Thermal Impedance: 5.1
* Dissipation coefficient
* Application: apply to all heatsinkf no fixed clip thermal paste. Idea for MOSFET Heatsink，VGA CARD Northbridge Southbridge Heatsink.
* Features: thermal properties, strong adhesion
* Melting capacity: 0 (200 ℃ / 24Hours)
* Evaporation: 0.001% (200 ℃ / 24Hours)
* Thermal conductivity:> 1.2W/m-K
* Thermal Impedance: 5.1
* Dissipation coefficient
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