Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging (Part 3)

Name: Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging (Part 3)
Author: R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
ISBN: 9780412084614

Author R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein

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Book Details

Author(s)R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein

ISBN / ASIN0412084619

ISBN-139780412084614

MarketplaceUnited States 🇺🇸