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Methodology for high aspect ratio pulse plating: periodic reverse pulse tanks were once seen as a current density capacity enhancement for "standard ... from: Printed Circuit Design & Manufacture

Author Robert D. Edwards
Publisher UP Media Group, Inc.
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Book Details
ISBN / ASINB0008GFKCO
ISBN-13978B0008GFKC8
AvailabilityAvailable for download now
Sales Rank9,921,642
MarketplaceUnited States 🇺🇸

Description

This digital document is an article from Printed Circuit Design & Manufacture, published by UP Media Group, Inc. on January 1, 2004. The length of the article is 3238 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.

Citation Details
Title: Methodology for high aspect ratio pulse plating: periodic reverse pulse tanks were once seen as a current density capacity enhancement for "standard thickness" boards. Now they churn out PCBs with aspect ratios of 15:1.(Pulse Plating)
Author: Robert D. Edwards
Publication:Printed Circuit Design & Manufacture (Magazine/Journal)
Date: January 1, 2004
Publisher: UP Media Group, Inc.
Volume: 21 Issue: 1 Page: 32(5)

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