This digital document is an article from Printed Circuit Design & Manufacture, published by Thomson Gale on September 1, 2005. The length of the article is 1640 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.
Citation Details
Title: Reflecting on mirrored IC pinouts: flipping the die within a package can shrink real estate and the number of vias and layers. But the chip makers will have to get on board first.(PACKAGING)
Author: Charles Clark
Publication:Printed Circuit Design & Manufacture (Magazine/Journal)
Date: September 1, 2005
Publisher: Thomson Gale
Volume: 22 Issue: 9 Page: 26(4)
Distributed by Thomson Gale
Reflecting on mirrored IC pinouts: flipping the die within a package can shrink real estate and the number of vias and layers. But the chip makers ... from: Printed Circuit Design & Manufacture
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Book Details
Author(s)Charles Clark
PublisherThomson Gale
ISBN / ASINB000BGK58K
ISBN-13978B000BGK583
AvailabilityAvailable for download now
Sales Rank99,999,999
MarketplaceUnited States 🇺🇸