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Advanced Materials for Thermal Management of Electronic Packaging by Tong, Xingcun Colin. (Springer,2011) [Hardcover]
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Book Details
PublisherSpringer,2011
ISBN / ASINB00E2RIMPM
ISBN-13978B00E2RIMP6
Sales Rank99,999,999
MarketplaceUnited States 🇺🇸
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Advanced Materials for Thermal Management of Electronic Packaging by Tong, Xingcun Colin. . Springer, 2011 .