Flip-Chip Bonding Equipment for UV Focal Plane Array Development Based on GaN/AlGaN p-i-n Photodiodes

Name: Flip-Chip Bonding Equipment for UV Focal Plane Array Development Based on GaN/AlGaN p-i-n Photodiodes
Author: Jan Schetzina
ISBN: 978B00JOUC7P5

Author Jan Schetzina

Publisher PN

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Book Details

Author(s)Jan Schetzina

PublisherPN

ISBN / ASINB00JOUC7PS

ISBN-13978B00JOUC7P5

Sales Rank99,999,999

MarketplaceUnited States 🇺🇸