Fatigue Life Prediction of Solder Joints in Electronic Packages with AnsysÂ® (The Springer International Series in Engineering and Computer Science) by Erdogan Madenci (2002-12-31)

Name: Fatigue Life Prediction of Solder Joints in Electronic Packages with AnsysÂ® (The Springer International Series in Engineering and Computer Science) by Erdogan Madenci (2002-12-31)
Author: Erdogan Madenci; Ibrahim Guven; Bahattin Kilic;
ISBN: 978B01A1NEND6