Fatigue Life Prediction of Solder Joints in Electronic Packages with AnsysÂ® (The Springer International Series in Engineering and Computer Science) by Erdogan Madenci (2002-12-31)

Name: Fatigue Life Prediction of Solder Joints in Electronic Packages with AnsysÂ® (The Springer International Series in Engineering and Computer Science) by Erdogan Madenci (2002-12-31)
Author: Erdogan Madenci; Ibrahim Guven; Bahattin Kilic;
ISBN: 978B01A1NEND6

Author Erdogan Madenci; Ibrahim Guven; Bahattin Kilic;

Publisher Springer; 2003 edition (2002-12-31)

📄 Viewing lite version Full site ›

🌎 Shop on Amazon — choose country

🇺🇸 USA 🇨🇦 Canada 🇬🇧 UK 🇩🇪 Germany 🇫🇷 France 🇮🇳 India

⌛ 🇫🇷 France pricing being fetched… Prices will appear once fetched — usually within a few minutes.

View in: 🇺🇸 USA

Book Details

Author(s)Erdogan Madenci; Ibrahim Guven; Bahattin Kilic;

PublisherSpringer; 2003 edition (2002-12-31)

ISBN / ASINB01A1NENDA

ISBN-13978B01A1NEND6

MarketplaceFrance 🇫🇷

Description ▲

Brand New. Will be shipped from US.